MicroLED Display Process

Epitaxy, or EPI for short, is the most important process in the front end of MicroLED, and the condition of the epitaxy will have a significant impact on the subsequent process. Therefore, it is very important to be able to detect the problems. CST provides suitable inspection solutions for MicroLED EPI.

CMOS/TFT backplanes, as the driving force of MicroLEDs, are also an integral part of the entire MicroLED process. As a result, CST provides CMOS/TFT backplanes with related materials and inspection solutions.

The process is to assemble and bond the EPI to the CMOS/TFT backplane so that the driver circuits on the backplane can be combined with the EPI to form the MicroLED die. CST provides a complete process and inspection solution for the assembly and bonding.

The process is to transfer the finished MicroLED die to the target carrier board. As a key technology for MicroLED, CST provides a complete solution of mass transfer.

We perform various tests on the transferred products to ensure the quality of the products. CST provides the most suitable inspection solutions.

For the conversion and adjustment of the display gamut of the transferred products, CST provides suitable materials and related testing solutions.

CST will provide suitable process and inspection solutions for this process, which involves laminating the glass display panel to the transferred MicroLED product.