Thermal Bonding Machine
Thermal Bonding Machine is a high-precision mechanism to assemble LED substrate and CMOS Wafer, and then use a high-temperature device for metal eutetic bonding. The purpose of the operation is to bond the LED substrate and CMOS Wafer so that the metal electrode pins of the LED and the CMOS Wafer are connected and conductive, and consequently the LEDs can be driven and lit by the CMOS bonding with IC.
- The LED Chip in the 6"" metal frame LEDs are individually selected to the upper Stage by the high precision picker with CCD.
- Using Robot to transfer the 8"" CMOS to the aligner for positioning, and then precisely transfer to the lower Stage for adsorption.
- Adopt high-precision alignment system and micron-sized lifting mechanism to align the LED Chip with CMOS.
- Heating system and constant temperature system to heat the LED Chip in the whole area for fast eutectic.
Added to your inquiry
CST_ThermalBonding
Thermal Bonding Machine