Automatic De-Frame & Cleaner

deframe_cleaner
Automatic De-Frame & Cleaner

Automatic De-Frame & Cleaner is connected behind P&P Process. It is used for automatically wafer de-frame/packaging/wet process frame cleaning and equipped with inspection function. It can efficiently reduce OP’s working manpower.

Benefits

Auto De-frame & Cleaner can automatically de-frame from blue tape, and take and save picture of wasted die. It can clean Frame residue at back & front side, and has residue and flatness inspection function. It can also efficiently reduce OP’s working manpower and manage the cleanness and warpage of the frame. Wasted tape will be labeled automatically for following query.

Specification & Features

  • Applied with 8” & 12” Wafer.
  • Can automatically switch working size. 
  • OCR Reader for Wafer Identification.
  • Taking and Saving Picture for NG DIE
  • Including Wafer de-frame, wet process frame cleaning, packaging and labeling functions.
  • Flatness/Residue Detect Function Equipped.
  • Back & Front side cleaning supported.
  • Cleaning circle/liquid amount/speed can be controlled by parameters.
  • For E84 SPEC.
  • For SECS/GEM SPEC.


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