Wafer Warpage Measurement

warpage_measure
Wafer Warpage Measurement
Wafer Warpage Measurement is used for measuring warpage to check whether the product meets customer’s requirement. 

Application

Wafer Warpage Measurement can be used for any semiconductor process (front-end/back-end/package…etc.)

Benefits

Wafer Warpage Measurement can control the difference of wafer warpage, and avoid problems which may cause loss to happen through the process.

Specification & Features

  • Applied for 8” & 12”Wafer
  • Measure Head Measurement Repeatability: ±0.5um
  • Robot warpage capability: +6 mm/-6mm
  • Applied Wafer Thickness: 430~980um
  • 360° Measurement
  • Mininum measurement setting angle for 1°
  • Machine Measurement Repeatability: ±1um
  • Applied for E84 SPEC & SECS/GEM SPEC

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